A Study Of Power Semiconductor Packaging Trends Using Topic Modelling

Abstract

An analysis was performed on the packaging technology for power semiconductors for electric vehicles. Topic modelling was performed by applying the LDA technique by deriving the error by collecting unstructured research data. It was classified into various
topics, and the extracted words for each topic were the definition of technology. Hot topic by topic through regression analysis of frequency by year for trend analysis of each topic and Cold topics were derived, and the trends of power semiconductor packaging
technology were analysed. Construction according to withstand voltage Crude technology, input/output related control technology, and heat dissipation technology were derived, and inductance reduction technology was derived. This study will encourage more diversity when performing topic modelling and help determine what topic modelling method best suits.